AJAT has developed and is offering proprietary manufacturing services. Specifically hybridization of ASIC to CdTe, CdZnTe and Si detector substrates, testing (prior and post hybrization) and automatic hybrid (die) assembly and wirebonding to plurality of substrates.
AJAT is the world leader in producing CdTe-CMOS hybrids. AJAT’s patented manufacturing process is specialized in applications where high interconnection density and low temperature soldering are required.
Services in nutshell:
> Solder bumping (SnBi, SnPb)
> Flip-Chip bonding
> Automatic Hybrid/Die placement
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AJAT has designed in-house all of its CMOS generations and functionality. We have more than 15 years of experience in full custom design of imaging CMOS design for radiation detectors. Specifically the following broad functionalities are readily available:
> Charge integration
> Photon Counting
> On chip Time Delay Integration (TDI)
Mixed signal design is a very niche and challenging domain where AJAT pocesses particular expertise in:
> Amplifier design (AC coupled in case of photon counting)
> Ultra high sensitivity charge integration
> Large CMOS active areas (several cm**2)
> On chip analog to digital conversion
> On pixel analog to digital conversion
> On pixel counters
> Power consumption reduction and power grid uniformity
We can tailor our designs to customer needs and specifications.